JPH03112326U - - Google Patents
Info
- Publication number
- JPH03112326U JPH03112326U JP2258390U JP2258390U JPH03112326U JP H03112326 U JPH03112326 U JP H03112326U JP 2258390 U JP2258390 U JP 2258390U JP 2258390 U JP2258390 U JP 2258390U JP H03112326 U JPH03112326 U JP H03112326U
- Authority
- JP
- Japan
- Prior art keywords
- opening
- mold
- resin pipe
- mold body
- branch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2258390U JPH0711961Y2 (ja) | 1990-03-05 | 1990-03-05 | 樹脂管の分岐口引き抜き加工金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2258390U JPH0711961Y2 (ja) | 1990-03-05 | 1990-03-05 | 樹脂管の分岐口引き抜き加工金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03112326U true JPH03112326U (en]) | 1991-11-18 |
| JPH0711961Y2 JPH0711961Y2 (ja) | 1995-03-22 |
Family
ID=31525588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2258390U Expired - Lifetime JPH0711961Y2 (ja) | 1990-03-05 | 1990-03-05 | 樹脂管の分岐口引き抜き加工金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0711961Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012146704A (ja) * | 2011-01-06 | 2012-08-02 | Renesas Electronics Corp | 半導体装置、リードフレーム、及び半導体装置の製造方法 |
-
1990
- 1990-03-05 JP JP2258390U patent/JPH0711961Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012146704A (ja) * | 2011-01-06 | 2012-08-02 | Renesas Electronics Corp | 半導体装置、リードフレーム、及び半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0711961Y2 (ja) | 1995-03-22 |
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